Our TGV sapphire substrates are manufactured from high-quality sapphire wafers and processed with precision micro-machining technology to form through-via holes, blind holes, square cavities, patterned windows, and customized microstructures.

Compared with ordinary glass materials, sapphire offers higher mechanical strength, better scratch resistance, excellent thermal stability, and strong chemical durability. These properties make sapphire an ideal substrate material for demanding semiconductor, optical, and electronic applications.

The through-via structure can support vertical interconnection design, signal routing, device alignment, packaging integration, and functional microstructure development. Hole diameter, hole pitch, substrate thickness, pattern layout, edge shape, and surface finish can be customized according to customer drawings.

Key Features

Typical Specifications

Applications

Advanced Semiconductor Packaging
Used as a high-strength transparent carrier or functional substrate for wafer-level packaging, interposer research, and vertical interconnection structures.

MEMS and Sensor Devices
Suitable for micro-hole arrays, pressure sensing windows, optical sensing structures, and precision alignment components.

Optical and Photonic Modules
Sapphire provides excellent transparency and dimensional stability for optical windows, laser modules, photonic packaging, and inspection devices.

RF and High-Frequency Devices
The insulating property and stable material performance of sapphire make it suitable for selected electronic and RF-related substrate applications.

Microfluidic and Lab-on-Chip Components
Customized holes, channels, cavities, and windows can be processed according to device design requirements.

Why Choose Sapphire for TGV Substrate?

Sapphire is not ordinary glass. It is a single-crystal aluminum oxide material with outstanding hardness, thermal stability, chemical resistance, and electrical insulation. For applications requiring both transparency and mechanical durability, sapphire can provide better long-term reliability than many conventional glass substrates.

Its stable structure also makes it suitable for precision micro-hole processing and patterned substrate manufacturing, especially where clean edges, high strength, and dimensional control are important.

Custom Manufacturing Capability

We can manufacture TGV sapphire substrates according to customer drawings or technical requirements, including:

Hole diameter and depth customization
Hole array layout and pitch control
Round wafer or square substrate processing
Square window and cavity machining
Double-side polishing
Edge grinding and chamfering
Small-batch samples and customized production

Customers can provide drawings in PDF, CAD, STEP, DXF or basic specification information for evaluation.

FAQ

Q1: What is a TGV sapphire substrate?
A TGV sapphire substrate is a sapphire wafer or plate processed with through-via holes or micro-hole arrays. These holes can be used for vertical connection, alignment, packaging, sensing, or customized device structures.

Q2: Can the hole size and layout be customized?
Yes. Hole diameter, hole pitch, hole quantity, pattern layout, substrate thickness, and external shape can all be customized according to customer drawings.

Q3: Is sapphire better than glass for TGV applications?
Sapphire offers higher hardness, better scratch resistance, stronger mechanical stability, and excellent chemical resistance. It is suitable for demanding applications where ordinary glass may not provide enough strength or durability.

Q4: What information is needed for quotation?
Please provide material type, substrate size, thickness, hole diameter, hole quantity, hole spacing, pattern drawing, surface finish requirement, tolerance requirement, and order quantity.

Related Products

Small-Size Sapphire TGV Micro-Via Wafer for Laboratory Prototyping, MEMS Devices and Optical Micro-Structure Applications