​​Title: Breakthrough in 12-Inch Silicon Carbide Wafer Laser Liftoff Technology – Beijing Jinfei Semiconductor Technology Co., Ltd.​​

Recently, Beijing Jinfei Semiconductor Technology Co., Ltd., a leading domestic semiconductor equipment manufacturer, achieved a significant breakthrough in silicon carbide (SiC) wafer processing technology. The company successfully implemented its independently developed laser liftoff equipment to produce 12-inch silicon carbide wafers. This milestone marks China’s critical advancement in third-generation semiconductor manufacturing equipment and provides a novel solution for global cost reduction and efficiency enhancement in the SiC industry. The technology has already passed client validation for 6-inch and 8-inch SiC applications, demonstrating performance aligned with international standards.

​​Key Implications of This Technological Breakthrough for the SiC Industry​​:

1.​Significantly reducing production costs​​:

Compared to mainstream 6-inch wafers, 12-inch SiC wafers expand usable wafer area by ~4x, reducing unit chip costs by 30%–40%.

2.​​Enhancing industrial supply capacity​​:

Resolving technical bottlenecks in large-dimension SiC wafer processing, this innovation supports global capacity expansion for SiC production.

3.​​Accelerating domestic substitution​​:

Breaking foreign monopolies in large-size SiC processing equipment, this achievement strengthens China’s self-sufficiency in semiconductor manufacturing infrastructure.

4.​​Expanding downstream applications​​:

Cost reductions will expedite SiC device adoption in electric vehicles, renewable energy, and other high-growth sectors.

Beijing Jinfei Semiconductor Technology Co., Ltd., a spin-off enterprise from the Institute of Semiconductors, Chinese Academy of Sciences, specializes in R&D, production, and sales of semiconductor-specific equipment. Focused on laser application technology, the company has developed proprietary semiconductor processing systems serving major domestic semiconductor manufacturers.

​​CEO Statement​​:

“Adhering to technological innovation as our core driver, this breakthrough in 12-inch SiC laser liftoff technology reflects our technical expertise and the robust support from Beijing Municipal Science & Technology Commission, the Institute of Semiconductors (CAS), and the ‘Disruptive Technology Innovation’ key special project led by the Jing-Jin-Tang National Innovation Center. Moving forward, we will intensify R&D investments to deliver higher-performance semiconductor equipment solutions for our clients.”

Conclusion

ZMSH, with ​​end-to-end self-controllability​​ at its core, delivers ​​one-stop solutions​​ spanning customized equipment design, process optimization, and mass production. Leveraging breakthroughs in ​​laser liftoff technology​​, we have achieved ​​high-efficiency mass production of domestically produced 12-inch silicon carbide (SiC) wafers​​, enabling clients to rapidly establish ​​low-cost, high-performance supply chains​​. Through ​​nationally produced equipment​​ and a ​​localized service network​​, we guarantee ​​48-hour response times​​ to client demands and foster ​​ecological synergy​​ across the value chain—from substrates to devices—to accelerate the scalable adoption of SiC technology in electric vehicles, renewable energy, and other critical sectors.